Modeling and Simulation for Microelectronic Packaging Assembly
By:"Sheng Liu","Yong Liu"
Published on 2011-08-24 by John Wiley & Sons
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming \
This Book was ranked 28 by Google Books for keyword Multiphysics Modeling.
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